Signal Integrity Tips and Techniques Using TDR, VNA Modeling

Signal integrity

(SI) is all about the losses and types of signal degradation that can happen along the path (channel) between a transmitter and a re-ceiver.

• SI engineers are faced with the challenge of how to characterize the signal losses that exist in the channel and identify the key elements that are controlling the performance.

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The use of time and frequency domain analyses for both simulation and measurements is a fast way of becoming an expert on a given channel design.

SIMULATION MODELING

• A fully up-to-date introduction to signal integrity and physical design • New questions and problems designed for both students and professional engineers • How design and technology selection can make or break power distribution network performance • Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance • Practical techniques for analyzing resistance, capacitance, inductance, and impedance • Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances • Identifying reflections and crosstalk with free animation tools • Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement • Understanding how interconnect physical design impacts signal integrity • Managing differential pairs and losses • Harnessing the full power of S-parameters in high-speed serial link applications • Designing high-speed serial links associated with differential pairs and lossy lines—including new coverage of eye diagrams • Ensuring power integrity throughout the entire power distribution path • Realistic design guidelines for improving signal integrity, and much more

Signal and Power Integrity – Simplified, 3rd Edition

• By Eric Bogatin

Chapter 1 Signal Integrity Is in Your Future 1
1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility? 3
1.2 Signal-Integrity Effects on One Net 7
1.3 Cross Talk 11
1.4 Rail-Collapse Noise 14
1.5 Electromagnetic Interference (EMI) 17
1.6 Two Important Signal-Integrity Generalizations 19
1.7 Trends in Electronic Products 20
1.8 The Need for a New Design Methodology 26
1.9 A New Product Design Methodology 27
1.10 Simulations 29
1.11 Modeling and Models 34
1.12 Creating Circuit Models from Calculation 36
1.13 Three Types of Measurements 42
1.14 The Role of Measurements 45
1.15 The Bottom Line 48
Review Questions 50
Chapter 2 Time and Frequency Domains 51
2.1 The Time Domain 52
2.2 Sine Waves in the Frequency Domain 54
2.3 Shorter Time to a Solution in the Frequency Domain 56
2.4 Sine-Wave Features 58
2.5 The Fourier Transform 60
2.6 The Spectrum of a Repetitive Signal 62
2.7 The Spectrum of an Ideal Square Wave 64
2.8 From the Frequency Domain to the Time Domain 66
2.9 Effect of Bandwidth on Rise Time 68
2.10 Bandwidth and Rise Time 72
2.11 What Does Significant Mean? 73
2.12 Bandwidth of Real Signals 77
2.13 Bandwidth and Clock Frequency 78
2.14 Bandwidth of a Measurement 80
2.15 Bandwidth of a Model 83
2.16 Bandwidth of an Interconnect 85
2.17 The Bottom Line 89
Review Questions 90
Chapter 3 Impedance and Electrical Models 93
3.1 Describing Signal-Integrity Solutions in Terms of Impedance 94
3.2 What Is Impedance? 97
3.3 Real Versus Ideal Circuit Elements 99
3.4 Impedance of an Ideal Resistor in the Time Domain 102
3.5 Impedance of an Ideal Capacitor in the Time Domain 103
3.6 Impedance of an Ideal Inductor in the Time Domain 107
3.7 Impedance in the Frequency Domain 109
3.8 Equivalent Electrical Circuit Models 115
3.9 Circuit Theory and SPICE 117
3.10 Introduction to Measurement-Based Modeling 121
3.11 The Bottom Line 126
Review Questions 128
Chapter 4 The Physical Basis of Resistance 131
4.1 Translating Physical Design into Electrical Performance 132
4.2 The Only Good Approximation for the Resistance of Interconnects 133